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  • M. Vervaeke et al., “Satelitte payloads with optical interconnects: Solving the bandwidth bottleneck in space,” in Proc. ICO Information Photonics, 2011, pp. 1–2.

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  • P. Samyn, J. Van Erps, H. Thienpont, and G. Schoukens, “Paper coatings with multi-scale roughness evaluated at different sampling sizes,” Appl. Surf. Sci, vol. 257, no. 13, pp. 5613–5625, 2011.

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  • E. Bosman et al., “Ultrathin Optoelectronic Device Packaging in Flexible Carriers,” IEEE J. Sel. Top. Quantum Electron., vol. 17, no. 3, pp. 617–628, 2011.

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  • H. Thienpont and J. Van Erps, “Micro-optics components and technologies: key-innovators for research and industry.,” in Proc. 35th Optical Societ of India Symposium, International Conference on Contemporary Trends in Optics and Optoelectronics, 2011, pp. 6–7.

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  • P. Samyn et al., “Interaction of hybrid organic nanoparticles into films with micro- to nanoscale roughness,” in Proc. European Conf. on Nano Films (ECNF), 2010.

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  • J. Van Erps, A. Pakula, S. Tomczewski, M. Vervaeke, L. Salbut, and H. Thienpont, “Populating multi-fiber fiberoptic connectors using an interferometric measurement of fiber tip position and facet quality,” in Proc. SPIE, Micro-Optics, VCSELs, and Photonic Interconnects III, 2010, vol. 7716, p. 77161I.

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  • J. Van Erps, A. Pakula, S. Tomczewski, L. Salbut, M. Vervaeke, and H. Thienpont, “In Situ Interferometric Monitoring of Fiber Insertion in Fiber Connector Components,” IEEE Photonics Technol. Lett., vol. 22, no. 1, pp. 60–62, 2010.

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  • J. Van Erps, C. Debaes, and H. Thienpont, “Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections,” IEEE J. Sel. Top. Quantum Electron., vol. 16, no. 5, pp. 1347–1354, 2010.

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  • J. Van Erps, N. Hendrickx, E. Bosman, P. Van Daele, C. Debaes, and H. Thienpont, “Design and fabrication of embedded micro-mirror inserts for out-of-plane coupling in PCB-level optical interconnections,” in Proc. SPIE, Micro-Optics, VCSELs, and  Photonic Interconnects III, 2010, vol. 7716, p. 77161Q.

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  • J. Van Erps et al., “MT-compatible interface between peripheral fiber ribbons and printed circuit board-integrated optical waveguides,” in Proc. SPIE, PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS IX, 2009, vol. 7221, p. 72210C.

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