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Together with colleagues from the Centre for Microsystems Technology (CMST) of Ghent University, B-PHOT researchers have demonstrated the development of an advanced packaging technique for embedding thinned-down optoelectronic devices in flexible substrates. Vertical cavity surface emitting lasers and photodiodes were thinned down to 20 μm thickness, and subsequently embedded in a flexible carrier, resulting in a 75-μm-thin package, which can be bent to a radius of 2 mm. The research consortium showed that electrical integrated circuits (ICs) can be housed in the same thin ﬂexible package using the same technology. This new packaging approach was demonstrated in two different integrated sensor applications and in an integrated optical interconnect application. For the latter, waveguides and optical out-of-plane coupling elements were integrated in the package and the complete system was successfully subjected to reliability testing by accelerated aging experiments.