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  • N. Hendrickx, J. Van Erps, E. Bosman, H. Thienpont, and P. Van Daele, “Coupling structures for out-of-plane coupling in optical PCBs,” in Proc. SPIE Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication , Packaging and Integration, 2008, vol. 6992, p. 699226.

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  • R. Krajewski et al., “Characterization of the optical parameters of high aspect ratio polymer micro-optical components.,” in Proc. SPIE, Micro-Optics, VCSELs, and Photonic Interconnects II, 2008, vol. 6992, p. 699228.

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  • J. Van Erps et al., “A low loss 180 degrees coupling fiber socket making use of low bending loss hole-assisted fiber,” in Proc. SPIE, Micro-Optics, VCSEL’s, and Photonic Interconnects II, 2008, vol. 6992, p. 699203.

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  • C. Debaes et al., “WP9 project 9.1:Opto-PCB,” presented at the General Scientific Networking Meeting of NEMO, 2008.

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  • N. Hendrickx, G. Van Steenberge, E. Bosman, J. Van Erps, H. Thienpont, and P. Van Daele, “Towards flexible routing schemes for polymer optical interconnections on Printed Circuit Boards - art. no. 689904,” presented at the Proc. SPIE, PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS VIII, 2008, vol. 6899, p. 689904.

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  • J. Van Erps et al., “Replication of deep micro-optical components prototyped by Deep Proton Writing,” in Proc. SPIE, Micro-Optics, VCSELs, and Photonic Interconnects II, 2008, vol. 6992, p. 699208.

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  • J. Van Erps et al., “Mass manufacturable 180 degrees-bend single-mode fiber socket using hole-assisted low bending loss fiber,” IEEE Photonics Technol. Lett., vol. 20, no. 3, pp. 187–189, 2008.

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  • J. Van Erps et al., “Interferometric measurement system for fiber insertion and fixation in optical fiber connectors.,” presented at the General Scientific Networking Meeting of NEMO, 2008.

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  • J. Van Erps et al., “Fabrication of high aspect ratio micro-structures with large depth and high resolution using lithography methods.,” presented at the General scientific Networking Meeting of NEMO, 2008.

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  • J. Van Erps et al., “Enhanced pluggable out-of-plane coupling components for Printed Circuit Board-level optical interconnections,” in Proc. SPIE Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication , Packaging and Integration, 2008, vol. 6992, p. 699227.

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