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  • P. Finocchiaro et al., “A new generation of low-voltage single-photon micro-sensors with timing,” Nucl. Instrum. Methods Phys. Res. Sect. A., vol. 567, pp. 83–88, 2006.

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  • J. Van Erps et al., “High-Precision 2D SM fiber connectors fabricated through Deep Proton Writing,” IEEE  Photonics Technol. Lett., vol. 18, no. 10, pp. 1164–1166, 2006.

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  • G. Van Steenberge, N. Hendrickx, J. Van Erps, H. Thienpont, and P. Van Daele, “Laser ablation of Parallel Optical Interconnect waveguides,” IEEE Photonics Technol. Lett., vol. 18, no. 9, pp. 822–824, 2006.

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  • J. Van Erps et al., “Rapid prototyping of polymer Micro-Opto-Mechanical Components with Deep Proton Writing,” in Proc. Optical Fabrication and Testing, OFWA 6, 2006.

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  • J. Van Erps, H. Thienpont, M. Kujawinska, and J. Mohr, “The european Network of Excellence in Micro-Optics (NEMO),” in Proc. Conf. Optical Fabrication and Testing , Micro-Optics and Integrated Optics, OFMD1, 2006.

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  • C. Debaes et al., “Rapid micro-optical prototyping technology for fabricatiing optical interconnection modules at the MCM and PCB level,” in Proc. SPIE, Nanophotonics for Communication: Materials, Devices, and systems III, 2006, vol. 6393, p. 639302.

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  • N. Hendrickx, J. Van Erps, H. Thienpont, and P. Van Daele, “Embedded laser ablated micro-mirrors for intra-and out-of-plane coupling in multilayer optical interconnections,” in Proc. Annual Meeting of the IEEE-LEOS, 2006, pp. 575–576.

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  • N. Hendrickx, J. Van Erps, H. Thienpont, and P. Van Daele, “Tolerance Analysis of PCB-Integrated Optical Interconnects,” in Proc. Frontiers in Optics; Silicon and III-V Based Optoelectronics for Optical Interconnects I, FWO5, 2006.

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  • A. Tuan Nguyen et al., “Enhancement of  vector modulational instability,” in 2nd EPS-QEOD Europhoton2006 Conference, TuC9, 2006.

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  • J. Van Erps, L. Bogaert, B. Volckaerts, C. Debaes, and H. Thienpont, “Prototyping micro-optical components with integrated out-of-plane coupling structures using deep lithography with protons,” in Proc. SPIE Micro-optics, VCSELs and photonic interconnects II: Fabrication, Packaging and Integration, 2006, vol. 6185, p. 618504.

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