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  • C. Debaes et al., “Rapid micro-optical prototyping technology for fabricatiing optical interconnection modules at the MCM and PCB level,” in Proc. SPIE, Nanophotonics for Communication: Materials, Devices, and systems III, 2006, vol. 6393, p. 639302.

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  • N. Destouches et al., “AFM Benchmark for the profile charcterisation of sub-wavelength diffractive elements within the EC Network of Excellence on Micro-Optics (NEMO),” in Proc. SPIE, Optical Micro- and Nanometrology in Microsystems Technology, 2006, vol. 6188, p. 61881K.

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  • C. Debaes et al., “Low-cost plastic micro-optics for board level optical interconnections.,” in Proc. SPIE, Photonics Packaging and Integration, 2006, vol. 6126, pp. 225–223.

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  • U. Demirbas, A. Sennaroglu, N. Vermeulen, and H. Ottevaere, “Continuous-wave fiber-pumped Cr2+: ZnSe laser,” in Proc.SPIE, 2006, vol. 6190, p. 61900A.

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  • A. Sennaroglu, U. Demirbas, N. Vermeulen, H. Ottevaere, and H. Thienpont, “Continuous-wave broadly tunable Cr2+: ZnSe laser pumped by a thulium fiber laser,” Opt. Commun., vol. 268, no. 1, pp. 115–120, 2006.

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  • C. Debaes et al., “Low-cost micro-optical modules for board level optical interconnections,” in IEEE LEOS Newsletter, July-August Issue, 2005, vol. 19, pp. 12–14.

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  • H. Thienpont et al., “Optical Interconnects for Microelectronics,” in Proc. Horizons de l’Optique, 2005, p. 21.

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  • H. Thienpont et al., “Inter- and intrachip photonic interconnects using low-cost plastic micro-optical components and high density VCSEL arrays,” in Proc. Eg-MRS, 2005, pp. 59–60.

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  • H. Thienpont et al., “Chip-Scale Optical Interconnects,” presented at the 88th OSA Annual Meeting “Frontiers in Optics,” 2004, p. 118.

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  • L. Desmet et al., “Micro-Optics for Photonic Interconnections to Silicon chips,” presented at the International Conference on Optics, 2004, pp. 85–86.

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