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  • L. Desmet, S. Van Overmeire, J. Van Erps, H. Ottevaere, C. Debaes, and H. Thienpont, “Elastomeric inverse moulding and vacuum casting process characterization for the fabrication of arrays of concave refractive microlenses,” J. Micromech. Microeng., vol. 17, pp. 81–88, 2007.

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  • C. Debaes et al., “Deep Proton Writing: a tool for rapid prototyping of polymer micro-opto-mechanical modules,” in Proc. 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping (VRAP2007), 2007, pp. 515–520.

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  • J. Van Erps et al., “Low-cost, micro-optics for PCB-level photonic interconnects,” in Proc. SPIE, Optoelectronic Integrated Circuits IX, 2007, vol. 6476, p. 64760L.

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  • C. Debaes et al., “Deep Proton Writing: a rapid prototyping polymer microfabricationtool for micro-optical modules,” New J. Phys., vol. 8, no. 270, 2006.

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  • J. Van Erps et al., “Rapid prototyping of polymer Micro-Opto-Mechanical Components with Deep Proton Writing,” in Proc. Optical Fabrication and Testing, OFWA 6, 2006.

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  • C. Debaes et al., “Rapid micro-optical prototyping technology for fabricatiing optical interconnection modules at the MCM and PCB level,” in Proc. SPIE, Nanophotonics for Communication: Materials, Devices, and systems III, 2006, vol. 6393, p. 639302.

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  • N. Destouches et al., “AFM Benchmark for the profile charcterisation of sub-wavelength diffractive elements within the EC Network of Excellence on Micro-Optics (NEMO),” in Proc. SPIE, Optical Micro- and Nanometrology in Microsystems Technology, 2006, vol. 6188, p. 61881K.

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  • C. Debaes et al., “Low-cost plastic micro-optics for board level optical interconnections.,” in Proc. SPIE, Photonics Packaging and Integration, 2006, vol. 6126, pp. 225–223.

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  • C. Debaes et al., “Low-cost micro-optical modules for board level optical interconnections,” in IEEE LEOS Newsletter, July-August Issue, 2005, vol. 19, pp. 12–14.

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  • H. Thienpont et al., “Optical Interconnects for Microelectronics,” in Proc. Horizons de l’Optique, 2005, p. 21.

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