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  • J. Van Erps, N. Hendrickx, C. Debaes, P. Van Daele, and H. Thienpont, “Discrete out-of-plane coupling components for Printed Circuit Board-level optical interconnections,” IEEE Photonics Technol. Lett., vol. 19, no. 21, pp. 1753–1755, 2007.

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  • N. Hendrickx, J. Van Erps, G. Van Steenberge, H. Thienpont, and P. Van Daele, “Tolerance analysis for multilayer optical interconnections integrated on a Printed Circuit Board,” J. Lightwave Technol., vol. 25, no. 9, pp. 2395–2401, 2007.

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  • N. Hendrickx, J. Van Erps, G. Van Steenberge, H. Thienpont, and P. Van Daele, “Laser Ablated Micromirrors for Printed Circuit Board Integrated Optical Interconnections,” IEEE Photonics Technol. Lett., vol. 19, no. 11, pp. 822–824, 2007.

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  • P. Finocchiaro et al., “SPAD arrays and micro-optics: towards a real single photon spectrometer,” J. Mod. Opt., vol. 54, pp. 199–212, 2007.

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  • L. Desmet, S. Van Overmeire, J. Van Erps, H. Ottevaere, C. Debaes, and H. Thienpont, “Elastomeric inverse moulding and vacuum casting process characterization for the fabrication of arrays of concave refractive microlenses,” J. Micromech. Microeng., vol. 17, pp. 81–88, 2007.

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  • J. Van Erps, H. Van Amerongen, P. Toet, C. Debaes, J. Watté, and H. Thienpont, “High-precision single-mode fiber connectors fabricated through Deep Proton Writing,” in Proc. 13th Micro-Optics Conference (MOC’07), 2007, pp. 76–77.

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  • J. Van Erps, N. Hendrickx, Y. Ishii, C. Debaes, P. Van Daele, and H. Thienpont, “Pluggable coupling components for multilayer interconnections on the printed circuit Board-Level,” in Proc. 13th Micro-Optics Conference (MOC’07), 2007, pp. 74–75.

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  • M. Karppinen et al., “Integration of optical interconnects on circuit board,” in Proc. 13th Micro-Optics Conference (MOC’07), 2007, pp. 94–97.

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  • T. Nasilowski et al., “Sensing with photonic crystal fibres,” in Proc. IEEE International symposium on Intelligent Signal Processing (WISP 2007), 2007, pp. 1–6.

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  • C. Debaes et al., “Deep Proton Writing: a tool for rapid prototyping of polymer micro-opto-mechanical modules,” in Proc. 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping (VRAP2007), 2007, pp. 515–520.

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