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Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections

Publication date 2010
B-Phot Authors Jurgen Van Erps, Hugo Thienpont
DOI 10.1109/JSTQE.2009.2037158
Citation
J. Van Erps, C. Debaes, and H. Thienpont, “Design and Tolerance Analysis of Out-of-Plane Coupling Components for Printed-Circuit-Board-Level Optical Interconnections,” IEEE J. Sel. Top. Quantum Electron., vol. 16, no. 5, pp. 1347–1354, 2010.
Abstract We present the design of discrete out-of-plane coupling components featuring a micromirror for 90 degrees beam deflection in multimode optical interconnections at the printed circuit board level. We investigate the Goos-Hanchen shift that occurs upon total internal reflection at a 45 degrees micromirror and assess the influence of applying a metal reflection coating on the micromirror as well as the tolerance for mechanical misalignments using nonsequential ray tracing simulations. Finally, we compare the simulated performance with experimental measurements on out-of-plane coupling components prototyped with deep proton writing.
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