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Rapid micro-optical prototyping technology for fabricatiing optical interconnection modules at the MCM and PCB level

Publication date 2006
B-Phot Authors Michael Vervaeke, Jurgen Van Erps, Heidi Ottevaere, Alex Hermanne, Hugo Thienpont
DOI 10.1117/12.687168
Citation
C. Debaes et al., “Rapid micro-optical prototyping technology for fabricatiing optical interconnection modules at the MCM and PCB level,” in Proc. SPIE, Nanophotonics for Communication: Materials, Devices, and systems III, 2006, vol. 6393, p. 639302.
Abstract One of the remaining challenges to solve the interconnection bottlenecks at the Printed Circuit Board (PCB) and Multi-Chip-Module (MCM) level, is to adequately replace the galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. At our labs of the Vrije Universiteit Brussel we are therefore optimizing and deploying a rapid micro-optical prototyping technology for micro-optical interconnect modules, which we call Deep Proton Writing (DPW). An advantage of the DPW process is that it can create steep micro-optical surfaces, micro-holes, micro-lenses and alignment features in one irradation step. Hence, relative accuracies are very well controlled. In this report, we will address more specifically the following components, made each with the DPW technology: 1) out-of-plane couplers for optical wave-guides embedded in PCB, 2) peripheral fiber ribbons and two dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. We will give special attention to the optical tolerancing and the opto-mechanical integration of components in their packages. We use both a sensitivity analysis to misalignment errors and Monte-Carlo simulations. It is our aim to investigate the whole component integration chain from the optoelectronic device packaging to the micro-opto-mechanical assembly of the interconnect module.
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