Current electronic systems experience a continuous push towards higher density in interconnections, positioning of components and more compact modules and systems. The growing complexity of the chips by the growing integration in micro-electroncs fabrication increases however ever more the number of IO-channels on the chip and this put more stringent requirements of packaging technologies. The solution we propose here is to embed the chips in the printed circuit board itself, without any other form of packaging. This solution of embedded chips is a continuation along the evolution which can be obeserved in the packaging of chips. Besides this recent development to embed electronic chips, another trend can be obeserved, in particular the increasing use and integration of optical and opto-electronic components.
This project application aims at the research towards a useful technology that fulfills both of these trends, in particular embedding optic and opto-electronic chips in substrates and printed circuit boards.
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