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Optical Interconnects

Optical interconnects towards and on the board

Optical fibres are a vital part of high bandwidth interconnects throughout the world. At these, sometimes oceanspanning, distances optics have a clear advantage over electrical interconnects. But also on a smaller scale optics might solve design challenges that occur when implementing electrical interconnects. Power dissipation, aggregate bandwidth, immunity to electromagnetic interference, pin count and space constraints imply increasingly strengthened specifications towards electrical interconnects. We research the viability of optics to solve these challenges on different levels of the interconnect hierarchy: between racks, between printed circuit boards, on board and on chip.

Research Area


Main researcher(s)

Jurgen Van Erps Jurgen Van Erps
+32 497 80 07 94

Other people involved

Michael Vervaeke Michael Vervaeke
+32 485 40 03 95

Related research projects

Latest publications

  • J. Van Erps et al., “Low-cost, micro-optics for PCB-level photonic interconnects,” in Proc. SPIE, Optoelectronic Integrated Circuits IX, 2007, vol. 6476, p. 64760L.

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  • N. Hendrickx, J. Van Erps, G. Van Steenberge, H. Thienpont, and P. Van Daele, “Tolerance analysis for multilayer optical interconnections integrated on a Printed Circuit Board,” J. Lightwave Technol., vol. 25, no. 9, pp. 2395–2401, 2007.

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  • N. Hendrickx, J. Van Erps, G. Van Steenberge, H. Thienpont, and P. Van Daele, “Laser Ablated Micromirrors for Printed Circuit Board Integrated Optical Interconnections,” IEEE Photonics Technol. Lett., vol. 19, no. 11, pp. 822–824, 2007.

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  • N. Hendrickx, G. Van Steenberge, P. Geerinck, J. Van Erps, H. Thienpont, and P. Van Daele, “Laser-ablated coupling structures for stacked optical interconnections on printed circuit boards,” in Proc. SPIE Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication , Packaging and Integration, 2006, vol. 6185, p. 618503.

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  • C. Debaes et al., “Low-cost plastic micro-optics for board level optical interconnections.,” in Proc. SPIE, Photonics Packaging and Integration, 2006, vol. 6126, pp. 225–223.

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A full overview of all our publications can be found in our publication database

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Hugo Thienpont
Prof. Dr. Ir.
Hugo Thienpont
Managing Director
Nadia Cornand

Nadia Cornand
+32 2 791 68 52

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