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Prof. Van Erps guest editor JPhys Photonics' Focus Issue on Photonic Integrated Circuit Platforms


B-PHOT Professor Jürgen Van Erps will be the guest editor of JPhys Photonics' next Focus Issue on Photonic Integrated Circuit Platforms and their Packaging, together with Dr Victor Dolores-Calzadilla (TU Eindhoven).

"The recently launched EU Chips Act, aiming at increasing the resilience of Europe's semiconductor ecosystem, proposes amongst others to build on Europe's existing leading position and prepare the industry for future developments involving Integrated Photonics", says Prof. Van Erps. "This focus issue is therefore ideally suited to report on recent developments in that field!"

The journal recently received an impact factor of 3.8.


Photonic integrated circuit (PIC) technologies have matured rapidly in recent years, driven by the broadening of their application scope beyond telecommunications and the development of international foundries for PIC manufacturing. Multiple material platforms, such as InP, SOI, and SiN, have enabled low power consumption optical transmitters, modulators, detectors, and sensors on-chip. However, it became clear that a combination of different material platforms as well as the integration of specialty materials through hybrid or heterogeneous integration may pave the way towards novel functionalities. Because of the rapidly evolving nature of the field, it is an appropriate time to organize a Focus issue on this field.

Potential topics include, but are not limited to, the following:

  • Photonic integrated circuits
  • Heterogeneous integration
  • Hybrid integration
  • High-efficiency fiber-to-chip and chip-to-chip coupling interfaces, including mode conversion structures
  • Co-packaged optics
  • Optical interposers for PICs
  • Integrated photonics materials and devices
  • Packaging approaches, e.g. the move towards wafer-scale packaging
  • Polymer integrated photonics

Call for papers

We encourage submissions from all authors whose work fits this focus collection's scope. The collection will also feature invited contributions. All focus issue articles are subject to the same review process as regular articles. Authors are invited to contact one of the guest editors, or the journal team directly, to discuss the suitability of their work prior to submission.

The target deadline for submissions is 31st January 2024. We encourage early submission where possible, as articles will be published on acceptance without being delayed by other papers in the collection.

Impact factor: 3.8

Please submit your article via our online submission form. You should submit the appropriate article type for your submission, then choose 'Focus Issue on Photonic Integrated Circuit Platforms and their Packaging' from the drop-down menu.

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